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Timothy C. May

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Through Alpha particle, Clay and Radioactive decay

Discovery of alpha particle effects on computer chips

As an engineer, May was most noted for having identified the cause of the "alpha particle problem", which was affecting the reliability of integrated circuits as device features reached a critical size where a single alpha particle could change the state of a stored value and cause a single event upset. May realized that the ceramic packaging that Intel was using, made from clay, was very slightly radioactive. Intel solved the issue by increasing the charge in each cell to reduce its susceptibility to radiation and adopting plastic packaging for their products.

May co-authored the 1981 IEEE W.R.G. Baker Award-winning paper "Alpha-Particle-Induced Soft Errors in Dynamic Memories", published in the IEEE Transactions on Electron Devices in January 1979 with Murray H. Woods.

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